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Informationen
2019-06-11 09:25:40
Designed to last an IoT lifetime, SARA-R5 LTE-M / NB-IoT module
u-blox, the market leading Swiss wireless module manufacturer, has announced the new generation of LTE Low Cat. fully proprietary chipset and modules.
The UBX-R5 is designed and optimized to be utilized in a highly secure and reliable IoT professional enviroment, and it will be offered in the widely used SARA form factor. The new LTE-M / NB-IoT modules are named SARA-R510S and SARA-R510M8S, and can be equipped with high performance GNSS receiver section, based on a u-blox M8 GNSS chip with RF improvements bringing performance also with smaller GNSS antennas. By providing all technology building blocks in house and having full hardware and software ownership, u-blox can guarantee long-term device availability and provide lifetime support of the entire platform, down to the chipset level. Main features of the products include: • 3GPP Release 13/14 - M1 and NB2 • Built-in end-to-end security with hardware-based Root of Trust inside discrete Secure Element (EAL5+) • Accurate and reliable positioning, always and everywhere, with u-blox M8 GNSS receiver (up to 3 concurrent constellations) and RF improvements • Optimized ultra-low power consumption • Critical firmware updates delivered and services enabled via uFOTA • Simplified multi-regional deployments with each hardware variant • 5G-ready - once 5G LTE has been rolled out, the module will be upgreadable via software update • IoT protocol support: CoAP, MQTT, MQTT-SN, and LWM2M Device Management • Antenna dynamic tuning, to simplify support of many LTE bands • Cloud Certificate Provisioning, Zero Touch Provisioning for AWS FreeRTOS & IoT Device SDK and Azure IoT Device SDK • u-blox CellLocate®, CellTime, Last Gasp and other features First samples are scheduled for Q2'20. More information and resources are available on the manufacturers webpage: UBX-R5, SARA-R5
We will be happy to support you and provide complete information by our sales network.
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2026-09-17 11:05:28
International Industrial Fair (MSV) 2026
![]() Meet Microdis and EEPD at MSV Brno 2026, 6–9 October. Hall F, booths 223 & 235. Discover innovative electronic, embedded and industrial solutions and discuss your next project with our experts. https://www.bvv.cz/en/msv
2022-10-20 09:14:56
Evertiq Expo 2026 Warszawa
On 22 October 2026, we cordially invite you to Evertiq Expo 2026 in Warsaw, held at the PGE Narodowy Stadium. We will be pleased to welcome you at: Our Microdis Electronics booth – No. 44 Our partner E.E.P.D. GmbH – Booth No. 45 u-blox AG – Booth No. 139 Trasna Solutions – Booth No. 140
Free registration is available via the following link:
2020-04-22 23:58:32
Leoni Studer catalogue
Cables including BETAtherm and BETAflam series. |









